Sealing porous dielectric materials
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United States of America Patent
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Jul 14, 2009
Grant Date -
Oct 13, 2005
app pub date -
Jun 7, 2005
filing date -
Dec 12, 2003
priority date (Note) -
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Abstract
Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may besealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
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