Semiconductor module heatspreading lid having integrated separators for multiple chips

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11776866
APP PUB NO 20210183724A1
SERIAL NO

16994938

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor module includes a substrate having a central region, an outer region that surrounds the central region, and a middle region disposed between the central and the outer region, a first semiconductor package mounted on the central region of the substrate, a plurality of second semiconductor packages mounted on the middle region of the substrate, and a heat radiation structure disposed on the first semiconductor package and second semiconductor packages. The heat radiation structure includes a first part that is disposed on top surfaces of the first and second semiconductor packages, a second part that surrounds the middle region, a third part that is spaced apart from the second part and surrounds the first semiconductor package, and a fourth part that connects the second part to the third part.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Ae-Nee Seoul, KR 35 90
Kim, Youngbae Seoul, KR 48 414
Lee, Shle-Ge Seoul, KR 9 27

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