Semiconductor member, and process for preparing same and semiconductor device formed by use of same
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United States of America Patent
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May 12, 1998
Issued Date -
N/A
app pub date -
Nov 25, 1996
filing date -
Aug 3, 1990
priority date (Note) -
Expired
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Abstract
A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching.
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