Method of manufacturing semiconductor device that uses treatment to enhance hydrophilicity of spin coated insulating film
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United States of America Patent
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Mar 14, 2017
Grant Date -
Sep 1, 2016
app pub date -
Feb 25, 2016
filing date -
Feb 27, 2015
priority date (Note) -
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Abstract
To provide a semiconductor device having improved reliability. After formation of a first insulating film for an interlayer insulating film by spin coating, the surface of the first insulating film is subjected to a hydrophilicity improving treatment. A second insulating film for the interlayer insulating film is then formed on the first insulating film by spin coating. The interlayer insulating film is comprised of a stacked insulating film including the first insulating film and the second insulating film thereon. The interlayer insulating film therefore can have improved surface flatness.
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