Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
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United States of America Patent
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Jan 13, 2009
Grant Date -
Sep 2, 2004
app pub date -
Feb 26, 2004
filing date -
Feb 27, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
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