Fired body for manufacturing a substrate

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United States of America Patent

PATENT NO 5733640
SERIAL NO

08493616

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A fired body for manufacturing a substrate is pillar-shaped and includes metallic wires arranged inside the fired body in parallel with its axis. The melting point of the metallic wires is higher than the melting point, pour point or softening point of an insulating base body of the fired body. A method of manufacturing a substrate includes the steps or: forming a pillar-shaped unfired body in which metallic wire rods having a melting point higher than the firing temperature of a fired body are embedded inside and in parallel with the axis; firing the unfired body at a temperature higher than the melting point of the fired body; and cutting the fired body in a direction perpendicular to the axis and to a predetermined thickness.

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harayama, Yoichi Nagano, JP 18 502
Horiuchi, Michio Nagano, JP 132 1393
Takeuchi, Yukiharu Nagano, JP 30 745

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