Printed circuit board defective area transplant repair method
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United States of America Patent
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-
Dec 5, 2006
Grant Date -
Oct 27, 2005
app pub date -
Apr 27, 2004
filing date -
Apr 27, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting the printed circuit board area block plan, selecting the printed circuit boards, cutting out the area blocks, cutting the selected area blocks, applying the adhesive and fitting area blocks, adjusting the area block alignment, roller tamping the plastic band, curing the adhesive, and tearing off the plastic band. Following the reworking operations, defective printed circuit boards are restored into a good products capable of continuous use such that printed circuit board fabrication and production is even more economical and environmentally protective and, furthermore, printed circuit board manufacturing reaches maximum utilization rates, thereby effectively increasing practical production value.
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