Method of surface finishes for eliminating surface irregularities and defects
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United States of America Patent
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Jul 25, 2000
Issued Date -
N/A
app pub date -
Nov 20, 1997
filing date -
Aug 28, 1996
priority date (Note) -
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Abstract
A method for planarizing an exposed metal surface on a substrate is provided in which surface irregularities are eliminated. A photoresist layer is first removed from the substrate. Then a conformal planarizing head is placed in contact with the metal surface while chemical etchant essentially free of abrasives is supplied to an interface between the metal substrate and the planarizing head. The surface is then planarized until it is free of irregularties.
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