Housing module with semi-interlocking joints
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United States of America Patent
Stats
-
Jan 17, 1995
Grant Date -
N/A
app pub date -
Apr 9, 1993
filing date -
Apr 9, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An enclosure for housing electronic circuitry and the like, having a case and a cover which are mated together along edges thereof by substantially C-shaped flanges oriented in the same direction and asymmetrically with respect to each other to form semi-interlocking joints. Assembly and disassembly of the joints is accomplished by direct insertion and extraction without the need for sliding motion. The mating elements are locked together through the use of fasteners inserted into circular recesses formed by the flange members. The construction enables the use of internal dividing walls and shielding gaskets for forming electromagnetically isolated compartments within the housing enclosure.
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Family
International Classification(s)
Cited Art Landscape
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