Method for fabricating a high-bias semiconductor device

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United States of America Patent

PATENT NO 6117738
SERIAL NO

09196933

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Abstract

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A method for fabricating an improved structure of a high-bias device includes forming multiple doped wells between source/drain regions and a P-type substrate. The doped wells have an increasing order of dopant density from the P-type substrate for the P-type dopant or from a first N-type well for an N-type dopant. The doped multiple wells enclose the source/drain regions so that the source/drain regions do not directly contact with the substrate.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tung, Ming-Tsung Hsinchu Hsien, TW 48 385

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