Heat dissipation device including wire clips
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United States of America Patent
Stats
-
Jun 19, 2007
Grant Date -
Jan 20, 2005
app pub date -
Jul 16, 2004
filing date -
Jul 16, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat dissipation device includes a retention frame (60), a heat sink (40) and a pair of wire clips (20). The retention frame is mounted on a PCB (120) having an electronic component (140) thereon. The heat sink is surrounded in the retention frame. The heat sink includes a base (42) attached on the electronic component and a plurality of fins (44) extending from the base. The base defines holes (46) at opposite sides thereof along a length direction of the fins. Receiving spaces (48) are defined in the heat sink above the holes respectively. The clips respectively include resilient arms (26) received in the receiving spaces and pins (28) extending from the arms. The pins are received in the holes. A pair of latching portions (24) depends from each of the clips and are engaged with the retention frame, to thereby secure the heat sink to the electronic component.
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