Scalable high-bandwidth connectivity
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United States of America Patent
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May 6, 2014
Grant Date -
Nov 15, 2012
app pub date -
May 14, 2012
filing date -
May 12, 2011
priority date (Note) -
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Abstract
A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.
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