Forming a conductive pattern on a substrate
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United States of America Patent
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Sep 18, 2007
Grant Date -
Dec 7, 2006
app pub date -
Jun 6, 2005
filing date -
Jun 6, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of forming a conductive pattern on a substrate. The method comprising providing a substrate carrying a conductive layer; forming a first portion of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conductive material around the edge(s) of desired conductive region(s) of the first portion; and laying down an etch resistant material on the conductive layer, the etch resistant material defining a second portion of the conductive pattern, removing conductive material from those areas of the second portion not covered by the etch resistant material, and then removing the etch resistant material.
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