Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same

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United States of America Patent

PATENT NO 10804205
SERIAL NO

16548224

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Abstract

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The interconnect substrate mainly includes a stiffener, a core layer, a warp balancer and a routing circuitry. The stiffener has an elastic modulus higher than 100 GPa and is laterally surrounded by the core layer. The warp balancer is disposed over the top surface of the core layer and laterally surrounds a cavity aligned with the stiffener. The routing circuitry is disposed under the bottom surfaces of the stiffener and the core layer and electrically connected to the stiffener. By the high modulus of the stiffener, local thermo-mechanical stress induced by un-even thickness can be counterbalanced. Furthermore, adjusting the ratio of the stiffener thickness to the cavity dimension can maintain the cavity area stiffness and modulate the global flatness.

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Patent Owner(s)

  • BRIDGE SEMICONDUCTOR CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Charles W C Singapore, SG 215 3522
Wang, Chia-Chung Hsinchu County, TW 164 1648

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