One-component epoxy resin for covering electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 21, 2000
Grant Date -
N/A
app pub date -
Nov 12, 1998
filing date -
Nov 12, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.
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