Method for manufacturing wiring board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11785721
APP PUB NO 20220272847A1
SERIAL NO

17672067

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

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Patent Owner(s)

  • 501 TOYOTA JIDOSHA KABUSHIKI KAISHA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Akira Toyota, JP 460 6708
Kondoh, Haruki Okazaki, JP 18 4
Kuroda, Keiji Toyota, JP 41 368
Mori, Rentaro Kasugai, JP 24 106
Murai, Jyunya Nisshin, JP 7 0
Nakamura, Kenji Toyota, JP 547 8088
Okamoto, Kazuaki Toyota, JP 56 167
Okazaki, Tomoya Nagakute, JP 26 154
Yanagimoto, Hiroshi Miyoshi, JP 41 135

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