Lithography process window enhancement for photoresist patterning

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United States of America Patent

PATENT NO 11429026
SERIAL NO

16825393

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Abstract

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A method for enhancing the depth of focus process window during a lithography process includes applying a photoresist layer comprising a photoacid generator on a material layer disposed on a substrate, exposing a first portion of the photoresist layer unprotected by a photomask to light radiation in a lithographic exposure process, providing a thermal energy to the photoresist layer in a post-exposure baking process, applying an electric field or a magnetic field while performing the post-exposure baking process, and dynamically changing a frequency of the electric field as generated while providing the thermal energy to the photoresist layer.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bangar, Mangesh Ashok San Jose, US 9 1
Dai, Huixiong San Jose, US 55 1250
Nemani, Srinivas D Sunnyvale, US 252 11535
Ngai, Christopher S Burlingame, US 33 2239
Yieh, Ellie Y San Jose, US 123 4160

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