Method of fabricating a stacked die in die BGA package

United States of America Patent

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Oct 16, 2007
Grant Date
Dec 28, 2006
app pub date
Aug 29, 2006
filing date
Jan 9, 2002

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Abstract

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

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Patent Owner(s)

MICRON TECHNOLOGY, INC.

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

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Inventor Name	Address	# of filed Patents	Total Citations
Chew, Beng Chye	Singapore, SG	13	355
Lim, Thiam Chye	Singapore, SG	22	613
Neo, Chee Peng	Singapore, SG	19	372
Pour, Cheng Poh	Singapore, SG	13	362
Tan, Hock Chuan	Singapore, SG	16	370
Tan, Michael Kian Shing	Singapore, SG	12	355
Tan, Victor Cher Khng	Singapore, SG	15	549

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Method of fabricating a stacked die in die BGA package

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United States of America Patent

11511956

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PATENT NO	7282392
APP PUB NO	20060292746A1
SERIAL NO	11511956
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 16, 2007	US,7282392,B2 US7282392B2	GRANTED PATENT AS SECOND PUBLICATION
December 28, 2006	US,20060292746,A1 US20060292746A1	FIRST PUBLISHED PATENT APPLICATION

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11511956

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