Method of reducing residual contamination in singulated semiconductor die

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United States of America Patent

PATENT NO 10026605
APP PUB NO 20160372323A1
SERIAL NO

15255503

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Abstract

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In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.

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Patent Owner(s)

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doub, Jason Michael Pocatello, US 2 132
Grivna, Gordon M Mesa, US 225 2595

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