Leadless semiconductor product packaging apparatus having a window lid and method for packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 25, 2003
Grant Date -
N/A
app pub date -
Oct 6, 2000
filing date -
Mar 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common 'over-packaging' problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process. The compression-mold effectively provides a compressive sealing orifice from which the effective solderable areas of the lead-frame may extend and be exposed and, thus, avoid being coated with the polymer which is uniquely contained by the mold for packaging the internal portions of the lead-frame. The lead-frame is uniquely stamped and/or bent, conforming it to electro-mechanical requirements of a particular semiconductor product. By uniquely stamping and/or bending, the related art 'half-etching' of the lead for conforming it to electro-mechanical requirements of the packaged semiconductor product is no longer required. Environmental enhancement is achieved by conserving natural resources and by eliminating hazardous material by-products otherwise liberated in related art packaging techniques.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- MILLENNIUM MICROTECH (THAILAND) CO., LTD.;MILLENNIUM MICROTECH (USA) CO., LTD.
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chang, Sung Chul | Bangkok, TH | 4 | 316 |
Chun, DoSung | Muang nonthaburi, TH | 8 | 546 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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