Semiconductor device and method for forming the same

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United States of America Patent

PATENT NO 9252019
SERIAL NO

13222502

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Abstract

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A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fang-Cheng Hsin-Chu, TW 36 584
Chen, Huang-Ming Hsin-Chu, TW 31 182
Chen, Yung-Chung Hsin-Chu, TW 19 87
Lai, Chia-Han Zhubei, TW 21 122
Lei, Ming-Ta Hsin-Chu, TW 60 790
Tsai, Wen-Chi Hsin-Chu, TW 7 59
Wang, Mei-Yun Chu-Pei, TW 223 607
Wu, Chii-Ming Taipei, TW 105 1123

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