Methods and apparatus for processing a substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11315771
APP PUB NO 20220020578A1
SERIAL NO

16928606

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus for processing a substrate are provided herein. A method, for example, includes igniting a plasma at a first pressure within a processing volume of a process chamber; depositing sputter material from a target disposed within the processing volume while decreasing the first pressure to a second pressure within a first time frame while maintaining the plasma; continuing to deposit sputter material from the target while decreasing the second pressure to a third pressure within a second time frame less than the first time frame while maintaining the plasma; and continuing to deposit sputter material from the target while maintaining the third pressure for a third time frame that is greater than or equal to the second time frame while maintaining the plasma.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Connors, Paul Dennis San Mateo, US 1 0
Lo, Lewis Yuan Tse Saratoga, US 1 0
Pethe, Shirish A Cupertino, US 8 2
Riker, Martin Lee Milpitas, US 42 512
Tang, Xianmin San Jose, US 151 2187
Xie, Xiangjin Fremont, US 27 121
Zhang, Fuhong San Jose, US 40 634
Zhong, Lanlan Santa Clara, US 11 16

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