Semiconductor package

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United States of America Patent

PATENT NO 11557534
APP PUB NO 20210358838A1
SERIAL NO

17390109

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chae, Seung Hun Suwon-si, KR 47 132
Moon, So Yeon Suwon-si, KR 5 11
Shim, Ji Hye Suwon-si, KR 33 575

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