Thermally developable materials with buried conductive backside coatings
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United States of America Patent
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Aug 21, 2007
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app pub date -
Apr 13, 2006
filing date -
Apr 13, 2006
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Abstract
Thermally developable materials including photothermographic and thermographic materials having a buried conductive backside layer comprising one or more binder polymers, and an antistatic compound that is an organic solvent soluble alkali metal salt of any of a perfluorinated aliphatic carboxylic acid having 2 or 3 carbon atoms, a perfluorinated aliphatic sulfonate, or a tetrafluoroborate, provide antistatic coatings that exhibit little dependence on humidity.
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