Integrating a junction field effect transistor into a vertical field effect transistor

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United States of America Patent

PATENT NO 11011513
SERIAL NO

16665083

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Abstract

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Embodiments of the invention include first and second devices formed on a substrate. The first device includes a bottom source or drain (S/D) region, a plurality of fins formed on portions of the bottom S/D region, a bottom spacer formed on the bottom S/D region, a dielectric layer, a gate, a top S/D region formed on each fin of a plurality of fins, and one or more contacts. The dielectric layer is disposed between the gate and the fin of the plurality of fins. The second device includes a bottom doped region, a channel formed the bottom doped region, a sidewall doped region of the channel, a gate coupled to the sidewall doped region, a top doped region, and one or more contacts. A junction is formed between the channel and the sidewall doped region. The cap layer is formed on the gate and the top doped region.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Brent A Jericho, US 534 6633
Bu, Huiming Glenmont, US 108 1084
Hook, Terence B Jericho, US 210 1680
Liu, Xuefeng Schenectady, US 142 1423
Wang, Junli Albany, US 492 2761

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