Substrate processing method and substrate processing apparatus

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United States of America Patent

PATENT NO 11545355
APP PUB NO 20210143004A1
SERIAL NO

17097141

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Abstract

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A method for processing a substrate includes: (a) exposing a substrate with a pattern formed on a surface thereof to a first reactive species in a chamber, thereby adsorbing the first reactive species onto the surface of the substrate; (b) exposing the substrate to plasma formed by a second reactive species in the chamber, thereby forming a film on the surface of the substrate; and (c) repeating a processing including (a) and (b) two or more times while changing a residence amount of the first reactive species at a time of starting (b).

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hisamatsu, Toru Hillsboro, US 49 67
Honda, Masanobu Miyagi, JP 148 2678
Kumagai, Kae Miyagi, JP 10 1

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