Semiconductor material manufacture

United States of America Patent

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Apr 19, 2011
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Aug 5, 2010
app pub date
Feb 4, 2009
filing date
Feb 4, 2009

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Abstract

Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can be bonded to the bulk region using electromagnetic radiation. Additional apparatus, systems, and methods are disclosed.

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Patent Owner(s)

MICRON TECHNOLOGY, INC.

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Sandhu, Gurtej S	Boise, US	1216	32355
Sinha, Nishant	Boise, US	168	2085
Smythe, John	Boise, US	81	1502

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Semiconductor material manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12365734

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PATENT NO	7927975
APP PUB NO	20100193897A1
SERIAL NO	12365734
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 19, 2011	US,7927975,B2 US7927975B2	GRANTED PATENT AS SECOND PUBLICATION
August 05, 2010	US,20100193897,A1 US20100193897A1	FIRST PUBLISHED PATENT APPLICATION

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12365734

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