Polymer nanocomposite structures for integrated circuits
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United States of America Patent
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May 29, 2007
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app pub date -
Sep 8, 2004
filing date -
Sep 9, 2003
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Abstract
In accordance with certain embodiments consistent with the present invention, diamond nanoparticles are mixed with polymers. This mixture is expected to provide improved properties in interlayer dielectrics used in integrated circuit applications. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
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