MODULAR PCB AND METHOD OF REPLACING A MALFUNCTIONED MODULE OF THE PCB
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United States of America Patent
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Jun 19, 2007
Grant Date -
Jul 12, 2007
app pub date -
Jan 6, 2006
filing date -
Jan 6, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Modular PCB and method of replacing one of a plurality of modules of a first PCB are provided. One embodiment of the method includes checking each module of the first PCB and each of a plurality of modules of a second PCB, cutting a malfunctioned module from the first PCB to leave a rectangular vacant area if the malfunctioned module is found, forming a plurality of indents on each side of the vacant area, cutting a good module from the second PCB if the good module is found, forming a plurality of projections on each side of the good module, placing the good module in the vacant area for coupling the indents and the projections, and applying adhesive (e.g., resin) into the coupled indents and projections for fastening the good module in the vacant area.
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