Method of manufacturing high density encapsulated wire circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 5, 1987
Issued Date -
N/A
app pub date -
Sep 11, 1985
filing date -
Jun 28, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making a high density dimensionally stable encapsulated circuit board. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable. At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully