Composition of epoxy resin and triazine-formaldehyde-phenol resin
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United States of America Patent
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Feb 4, 2003
Grant Date -
Oct 18, 2001
app pub date -
Feb 15, 2001
filing date -
Feb 15, 2000
priority date (Note) -
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Abstract
An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): ##STR1## wherein R.sub.1 and R.sub.2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R.sub.3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.
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