Process for soldering and connecting structure
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United States of America Patent
Stats
-
Mar 29, 2005
Grant Date -
Jul 3, 2003
app pub date -
Dec 23, 2002
filing date -
Dec 28, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Bi, contacting the solder material with the barrier metal layer while the solder material is in a molten state; and solidifying the solder material. Thereby, when the electronic component is soldered to the substrate with the solder material such as an Sn--Bi based material or an Sb--Ag based material containing Bi, the degradation of a soldering part is avoided, and thus a sufficient thermal fatigue strength of the soldering part is obtained.
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