Method of edge bevel rinse
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United States of America Patent
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Aug 19, 2008
Grant Date -
Aug 16, 2007
app pub date -
Apr 12, 2006
filing date -
Feb 13, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.
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