Semiconductor package and package-on-package including the same
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 16, 2024
Grant Date -
Aug 31, 2023
app pub date -
May 5, 2023
filing date -
May 5, 2023
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package that includes a support wiring structure. A semiconductor chip is on the support wiring structure. A cover wiring structure is on the semiconductor chip. A plurality of connection structures penetrates a filling member and electrically connects the support wiring structure to the cover wiring structure. The filling member fills a space between the support wiring structure and the cover wiring structure. The filling member surrounds the plurality of connection structures and the semiconductor chip and includes a plurality of fillers. A partial portion of the plurality of fillers includes cutting fillers having a flat surface that extends along a vertical level that is a reference level.
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