Cover for microsystems and method for producing a cover

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8517545
APP PUB NO 20100330332A1
SERIAL NO

12736056

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.

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Patent Owner(s)

  • FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hofmann, Ulrich Itzehoe, DE 45 290
Oldsen, Marten Hamburg, DE 22 205
Quenzer, Hans Joachim Itzehoe, DE 19 252

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