Integrated circuit package assembly
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United States of America Patent
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Nov 9, 2021
Grant Date -
May 7, 2020
app pub date -
Jan 3, 2020
filing date -
Jan 19, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package assembly includes a first integrated circuit package and a second integrated circuit package. The first integrated circuit package includes a first integrated circuit die mounted on a first substrate. The second integrated circuit package includes a second integrated circuit die mounted on a second substrate. The second integrated circuit package is disposed under the first integrated circuit package. Solder bumps are disposed between the first integrated circuit package and the second integrated circuit package and provide electrical signal connections between the first integrated circuit die and the second integrated circuit die. A buffer layer is disposed between the first substrate and the second integrated circuit die to facilitate thermal conduction between the first integrated circuit package and the second integrated circuit package.
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