Radiation-sensitive positive resist composition comprising an o-quinone diazide, an alkali-soluble resin and a polyphenol compound
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United States of America Patent
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Feb 22, 1994
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N/A
app pub date -
Mar 31, 1993
filing date -
Sep 5, 1989
priority date (Note) -
Expired
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Abstract
A positive resist composition which comprises a 1,2-quinone diazide compound and an alkali-soluble resin containing a polyphenol compound (I) of the general formula: ##STR1## wherein R is a C.sub.1 -C.sub.5 alkyl group or a C.sub.1 -C.sub.5 alkoxy group, and n is a number of 0 to 3, which has good sensitivity, improved resolution and heat resistance.
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