Solder alloy composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6361742
SERIAL NO

09725609

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lead-free solder composition having superior mechanical strength is produced by adding a rare earth element to a Sn--Ag alloy or a Sn--Ag--Bi--Cu alloy.

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Patent Owner(s)

  • SONY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Habu, Kazutaka Tokyo, JP 17 105
Takeda, Naoko Tokyo, JP 12 64
Yamauchi, Kazushi Kanagawa, JP 20 644

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