Modular mainframe layout for supporting multiple semiconductor process modules or chambers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11935771
APP PUB NO 20220262653A1
SERIAL NO

17513631

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhimjiyani, Jitendra Ratilal Santa Clara, US 2 0
Dicaprio, Vincent Sunnyvale, US 55 2331
Grove, Coby Scott Whitefish, US 3 0
Harris, Randy A Kalispell, US 27 496
Nissan, Amir Sunnyvale, US 2 0
Pingle, Niranjan Milpitas, US 1 0
Shantaram, Avinash Whitefish, US 4 0
Wirth, Paul Zachary Kalispell, US 13 27
Yilmaz, Alpay San Jose, US 28 216

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