Method for manufacturing heat dissipator having heat pipes and product of the same
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United States of America Patent
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Feb 22, 2011
Grant Date -
Apr 2, 2009
app pub date -
Sep 28, 2007
filing date -
Sep 28, 2007
priority date (Note) -
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Abstract
A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.
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