Hydrogenated block copolymer, resin composition, pressure-sensitive adhesive, adhesive, molded object, liquid-packaging container, medical tool, medical tube, corner member for weather seal, and weather seal

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11279789
APP PUB NO 20210122868A1
SERIAL NO

17089404

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Abstract

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Provided are a hydrogenated block copolymer capable of giving a resin composition having good moldability and sufficient mechanical strength and excellent in flexibility, kink resistance and transparency and also excellent in pressure sensitive adhesiveness, adhesiveness and weather resistance, and a resin composition containing the hydrogenated block copolymer, as well as a pressure sensitive adhesive, an adhesive, a molded article, a liquid-packaging container, a medical tool, a medical tube, a corner member for weather seal, and a weather seal that are produced using these. Specifically, the hydrogenated block copolymer is a hydrogenated block copolymer prepared by hydrogenating a block copolymer that contains at least a polymer block (A) consisting mainly of a structural unit derived from an aromatic vinyl compound, and a polymer block (B) consisting mainly of a structural unit derived from isoprene, a structural unit derived from butadiene, or a structural unit derived from a mixture of isoprene and butadiene, wherein the content of the polymer block (A) is 1% by mass or more and less than 5% by mass relative to the total amount of the hydrogenated block copolymer, the total content of the 1,2-bond and the 3,4-bond of the polymer block (B) is 30 to 85 mol %, the hydrogenation rate of the polymer block (B) is 80 mol % or more, and the weight average molecular weight of the hydrogenated block copolymer is 150,000 to 800,000.

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Patent Owner(s)

  • KURARAY CO. LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Masuda, Mikio Kamisu, JP 12 41
Nojima, Yusuke Kamisu, JP 16 131
Oshita, Shinya Kamisu, JP 21 77

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