Leadless pressure sensors

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11519800
APP PUB NO 20210199526A1
SERIAL NO

16728490

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Importance

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Abstract

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Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

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Patent Owner(s)

  • HONEYWELL INTERNATIONAL INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
B, Manjesh Kumar Karnataka, IN 4 0
Bradley, Alistair David Hilliard, US 12 112
Fribley, Josh M Columbus, US 9 32
Sreeramu, Sudheer Beligere Karnataka, IN 7 1
Vadlamudi, Sathish Karnataka, IN 4 0

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