Wiring board and method of making the same
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United States of America Patent
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-
May 22, 2012
Grant Date -
Sep 17, 2009
app pub date -
Mar 10, 2009
filing date -
Mar 12, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.
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