Discharge electrode for a wire bonding apparatus
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United States of America Patent
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Nov 16, 2004
Grant Date -
Apr 1, 2004
app pub date -
Sep 25, 2003
filing date -
Sep 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A straight rod form discharge electrode used in a wire bonding apparatus. The electrode core material is covered, except for its tip end, by an alumina film that has been subjected to a pore sealing treatment. The alumina film subjected to the pore sealing treatment is formed by a two-stage process. In the first-stage, an alumina film having a porous structure is formed on the surface of the electrode core material for the thickness of approximately 6 .mu.m by plasma flame coating method or anodic oxidation method; and in the second-stage, the porous structure is subjected to a pore sealing treatment in which an alumina film is caused to adhere to the porous structure by laser PVD or a pore sealing treatment is performed with a resin.
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