Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
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United States of America Patent
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Jun 13, 2023
Grant Date -
N/A
app pub date -
Sep 28, 2020
filing date -
Sep 28, 2020
priority date (Note) -
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Abstract
A semiconductor package includes: a carrier having a first side and a second side opposite the first side, the first side having a plurality of contact structures; a semiconductor die having a first side and a second side opposite the first side, the first side of the semiconductor die having a plurality of pads attached to the plurality of contact structures at the first side of the carrier; a metal plate attached to the second side of the semiconductor die, the metal plate having a size that is independent of the size of the carrier and based on an expected thermal load to be presented by the semiconductor die; and an encapsulant confined by the carrier and the metal plate and laterally surrounding an edge of the semiconductor die. Corresponding methods of production are also provided.
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