Thermal interface layer for electronic device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11315852
APP PUB NO 20210111096A1
SERIAL NO

16599712

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Importance

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Abstract

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An electronic device includes a printed circuit board that supports an integrated circuit (IC) chip and a thermal interface layer that is configured to transfer thermal energy from the IC chip. The thermal interface layer includes a containment frame that is non-electrically conductive and a thermal conductance pane that is inset in the containment frame.

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Patent Owner(s)

  • APTIV TECHNOLOGIES LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brandenburg, Scott D Kokomo, US 78 823
Zimmerman, David W Noblesville, US 23 349

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