Method and apparatus for cooling electronic components
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United States of America Patent
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May 18, 2010
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N/A
app pub date -
Sep 26, 2006
filing date -
Sep 26, 2006
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Abstract
A method of cooling at least one electronic component that is configured to generate a predetermined waste heat includes providing a first fluid channeling sub-system that has a first fluid source and at least one controller. The method also includes channeling at least a portion of the first fluid towards the electronic component. The method further includes configuring the at least one controller to facilitate substantially maintaining at least a portion of the first fluid channeling sub-system at a predetermined pressure.
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