Method of manufacturing heat conductive substrate
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United States of America Patent
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Oct 9, 2007
Grant Date -
Feb 17, 2005
app pub date -
Mar 4, 2004
filing date -
Mar 29, 2002
priority date (Note) -
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Abstract
The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.
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