Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same

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United States of America Patent

PATENT NO 11414532
SERIAL NO

16123509

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Abstract

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A resin composition is provided. The resin composition comprises the following constituents:

    (A) epoxy resin;(B) a compound of formula (I),

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Patent Owner(s)

  • TAIWAN UNION TECHNOLOGYCORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Ju-Ming Chupei, TW 8 3
Liao, Chih-Wei Chupei, TW 63 204
Lin, Tsung-Hsien Chupei, TW 87 368
Tseng, Guan-Syun Chupei, TW 6 3

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