Methods for fabricating three dimensional integrated circuits
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United States of America Patent
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Jun 20, 2006
Grant Date -
Oct 28, 2004
app pub date -
May 17, 2004
filing date -
Jul 8, 2002
priority date (Note) -
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Abstract
A method of forming a semiconductor device includes fabricating digital circuits comprising a programmable logic circuit on a substrate; selectively fabricating either a memory circuit or a conductive pattern substantially above the digital circuits to program said programmable logic circuit; and fabricating a common interconnect and routing layer substantially above the digital circuits and memory circuits to connect digital circuits and one of the memory circuit or the conductive pattern.
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